Open ESL Technologies for Next Generation Embedded Systems (OpenES)

The capability of integrating advanced complex systems is one of the major European strengths. In order to remain competitive, the innovative system houses and semiconductor companies need to use advanced methods and design tools that are able to cope with complexity, heterogeneity and different kinds of constraints and requirements associated to the design of embedded systems.

In order to improve European electronics system design productivity (faster time-to-market), design quality (less design errors and less re-designs) to stay competitive, the OpenES consortium aims at developing common open and extensible solutions to provide an appropriate design framework and interfaces built on standards. Extensions on standards will be initiated where necessary.

OpenES project joins forces to provide missing links in system-level design and to develop common open solutions based on four pillars:

• Fill gaps in design flows with new interoperable tools and/or improve existing tools/flows ensuring the semantic continuity of the design flow.
• Specifically focus on integral support of both functional and extra-functional requirements from specification to verification, jointly with the use cases defined at system level.
• Raise reuse capabilities from IP to HW/SW subsystem in order to eliminate integration effort by supporting reuse of pre-integrated and pre-verified subsystems
• Enhance interoperability of models and tools by upgrading and extending existing young open standards (SystemC TLM, SystemC-AMS, IP-XACT)

More information?

You can find more information on this project at http://www.openes-project.org.